TSMC “will prepare a capacity for production of 50 million units of the chip before July, according to a Chinese-language Economic Daily News report,” Shen reports. “The A11 chips, which will power the upcoming iPhone series slated for launch in September 2017, will be built on a 10 nm FinFET process and packed with a wafer-level integrated fan-out (InFO) packaging technology, said the report.”
Shen reports, “TSMC is expected to maintain a capacity for rolling out 100 million A11chips before the end of 2017.”
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