“ARM and TSMC have announced a new multi-year agreement in order to develop ARM-based processors which are based on TSMC 10FinFET process technology,” Charlie Osborne reports for ZDNet. “The companies announced the new agreement on Thursday. The firms said that success in scaling from 20SoC to 16FinFET and the popularity of such technology influenced the new deal, and both ARM and TSMC will collaborate again for 10FinFET. ARM and TSMC hope that developing the roadmap early will result in 10FinFET designs as early as Q4 2015.”
“TSMC, also known as Taiwan Semiconductor, will base the new networking chips on 20SoC and 16FinFET in the ARM ecosystem in order to improve both performance and power consumption levels in next generation hardware,” Osborne reports. “Using a technique TSMC calls CoWoS (chip-on-wafer-on-substrate), the Taiwanese firm is able to combine different process nodes on a single substrate — which results in smaller hardware.”
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