“Taiwan Semiconductor Manufacturing Company (TSMC) has confirmed that its 20nm wafer starts were delayed recently due to a specification issue of materials used in its CMP (chemical mechanical planarization) process,” Josephine Lien and Steve Shen report for DigiTimes. “The issue has been resolved, and no shipments will be delayed, said the wafer foundry house.”
“TSMC began volume production of its 20nm process node at the beginning of 2014, focusing on Apple’s A8 processors, according to industry sources,” Lien and Shen report. “The yield rate of the 20nm process has been ramped up significantly since then, reaching a level ahead of schedule, the sources noted.”
Read more in the full article here.
MacDailyNews Take: Ah, dueling reports out of Asia. Looks like we’ll have to wait and see if anybody can figure out who’s really stamping what and how much for whom.
[Thanks to MacDailyNews Reader “Dan K.” for the heads up.]
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