Apple’s next-gen iPhone 14 Pro models will get thicker and have a more prominent camera bump on both Pro models, shared by Max Weinbach on Twitter. In addition, his schematics once again show the pill and hole punch display design.
It’s important to note that while rumors say the iPhone 14 could ditch the SIM card for the first time, the schematics don’t need to get this right, as it doesn’t impact case makers. On the other hand, the changes to the notch do impact accessory makers.
As you can see in the iPhone 14 Pro Max render [above], it will get slightly smaller than the previous generation at 77.58 mm in width. The height will decrease by 0.1 mm now measuring at 160.7 mm. As previously said, it will get slightly thicker with an increased camera sensor bump.
14 Pro and 14 Pro Max pic.twitter.com/39TMqVTFVc
— Max Weinbach (@MaxWinebach) March 22, 2022
MacDailyNews Take: Buh-bye, dreadful notch!
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Hello, ridiculous bump!
Still only three cameras on the back? Wherefore art thou, periscope zoom? Wherefore art thou, underscreen camera? Art thou only destined to arrived with the iPhone 20?
No fist bump for the bump, it should be bumped!
No SIM means more governmental control.