“In addition to Taiwan Semiconductor Manufacturing Company (TSMC), Chipbond Technology and MJC Probe (MPI) have entered the supply chain for Apple’s 2017 iPhone series, according to industry sources,” Julian Ho and Jessie Shen report for DigiTimes.
“TSMC with its 10nm process technology is believed to have obtained orders for Apple’s A11 processor which will power the 2017 iPhones, said the sources,” Ho and Shen report. “The Taiwan-based foundry will also offer its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology for the 10nm A11 chips beating Amkor Technology and other backend specialists.”
“In addition to the processor orders, TSMC has been contracted to manufacture OLED driver ICs for Apple, the sources claimed,” Ho and Shen report. “Apple’s iPhones to be launched in 2017 are set to feature OLED panels supplied by Korea-based panel vendors. Apple will use in-house developed OLED driver ICs.”
Read more in the full article here.
MacDailyNews Take: That is going to be some iPhone, but we’ll “settle” for our iPhone 7 Plus units for a year. 😉