“In keeping up with the trend towards thinner and lighter notebook models, Apple in a recent filing discloses methods for improving enclosure designs through parts that are structurally and electrically bonded together during the manufacturing process,” Prince McLean reports for AppleInsider.
McLean reports, “The technique, notes the Mac maker in a December 2006 continuation patent filing, offers an alternative approach to most existing notebook enclosures, which tend to be bogged down by weighty mechanical assemblies having parts that are screwed, riveted, snapped or otherwise fastened together at discrete points.”
McLean reports, “Lighter enclosures that use thinner plastic structures and less fasteners also exist, according to Apple, but they tend to be more flexible and therefore they have a greater propensity to buckle and bow than those having thicker, heavy mechanical assemblies. ‘Unfortunately, increased weight may lead to user dissatisfaction, and bowing may damage the internal parts of the portable computer,’ the company wrote in the filing.”
McLean reports, “Apple also notes that as the power and sophistication of integrated notebook circuits have increased, so has the level of electromagnetic interference. In order to prevent interference, PC manufacturers often shielded enclosures with an electrically conductive material to block the emission of electromagnetic radiation, which also leads to more weighty and bulky designs. ‘Although current enclosure designs work well,’ said Apple, ‘in many instances it would be desirable to provide enclosures that are thinner, lighter, stronger and aesthetically more pleasing than current enclosure designs.'”
McLean reports, “Specifically, the Cupertino-based firm’s patent proposal covers an enclosure having at least two unique parts that are structurally bonded together to form a singular composite structure with structural glue, or an enclosure having at least two unique parts that are electrically bonded together to form a singular integrated conductive member.”
Much more in the full article, including patent application illustrations, here.
[Thanks to MacDailyNews Reader “LinuxGuy and Mac Prodigal Son” for the heads up.]