“In keeping up with the trend towards thinner and lighter notebook models, Apple in a recent filing discloses methods for improving enclosure designs through parts that are structurally and electrically bonded together during the manufacturing process,” Prince McLean reports for AppleInsider.
McLean reports, “The technique, notes the Mac maker in a December 2006 continuation patent filing, offers an alternative approach to most existing notebook enclosures, which tend to be bogged down by weighty mechanical assemblies having parts that are screwed, riveted, snapped or otherwise fastened together at discrete points.”
McLean reports, “Lighter enclosures that use thinner plastic structures and less fasteners also exist, according to Apple, but they tend to be more flexible and therefore they have a greater propensity to buckle and bow than those having thicker, heavy mechanical assemblies. ‘Unfortunately, increased weight may lead to user dissatisfaction, and bowing may damage the internal parts of the portable computer,’ the company wrote in the filing.”
McLean reports, “Apple also notes that as the power and sophistication of integrated notebook circuits have increased, so has the level of electromagnetic interference. In order to prevent interference, PC manufacturers often shielded enclosures with an electrically conductive material to block the emission of electromagnetic radiation, which also leads to more weighty and bulky designs. ‘Although current enclosure designs work well,’ said Apple, ‘in many instances it would be desirable to provide enclosures that are thinner, lighter, stronger and aesthetically more pleasing than current enclosure designs.'”
McLean reports, “Specifically, the Cupertino-based firm’s patent proposal covers an enclosure having at least two unique parts that are structurally bonded together to form a singular composite structure with structural glue, or an enclosure having at least two unique parts that are electrically bonded together to form a singular integrated conductive member.”
Much more in the full article, including patent application illustrations, here.
[Thanks to MacDailyNews Reader “LinuxGuy and Mac Prodigal Son” for the heads up.]
No, I would expect that they would provide a service door of some sort or maybe some sort of elegant tray that allows techs to slide the components out easily.
Given that I’ve already explained this is how Lotus sticks its cars together and cars have to be serviced, I’m surprised that people think that this construction method will preclude Apple or any authorised service centre from maintaining or replacing components.
So long as structural rigidity is maintained, there is no reason why a MacBook can’t be exactly as maintainable as it is now: in fact, because there’s a reduced requirements for screws, fastners and washers (from a construction point of view) and a reduced requirement for internal cabling (due to the ‘electric ink’ part of the patent), it should make the systems even more maintainable.
This is simple common sense: Apple is hardly likely to spend tens of millions of dollars developing construction techniques that actually increase their liability on warranty costs going forward. Try and think laterally and the truth inevitably reveals itself.
excuse me… but that patent is referring to the technology that is used in the power book G4 titanium that I am typing this on right now… NOT NEW…. sorry
“Lotus sticks its cars together and cars have to be serviced”
I wasn’t aware that they glued all the engine and drive-train parts together rather then using bolts, and glued the hood down.
Show me one thing in a Lotus service manual which says, “First separate these two glued parts, then re-glue in this new part.
@Hmm, can you be reasonable in your comments? What you have just done is to display your ignorance or willingness to circumvent conventional wisdom.
Structural bonding is the key term here! Structure! not mechanism, not movable parts but the structure.
Is it safe to presume that your command of English vocabulary is limited? Because if you say it is, you can be excused for not understanding what the issue is about.
@ MCCFR On the point of premuim ice-cream, IBM are in the process of doing just that!!
They are developed a process of making the processing chips casing full of holes imitating a snow flake.
The chip code-named “Snowflake” Offers faster processing whilst consuming less energy.
http://news.bbc.co.uk/1/hi/technology/6618919.stm
About the ice-cream, Ice-cream is dairy cream with sugar flavourings and whipped to incorporate lots of holes, hence the expansion by volume of the cream. I wonder if this is how IBM are whipping up the chip casings?
Are you ready to look for other hobbies?
@TMF & TMF Copycats No comments about whipped cream and holes please!:-)
“Structural bonding is the key term here! Structure! not mechanism, not movable parts but the structure.”
So gluing parts of a case together? How innovative.