Alleged iPhone 6s schematics showing SiP architecture?

“As some of you might know, back in March, a new rumor claimed that when designing the iPhone 6s, Apple will go the Watch route by adopting the SiP (System in Package) architecture,” Vlad Andrici reports for G For Games.

“According to the originator of the schematics, it looks like Apple has indeed chosen to go the SiP route, with the A9 SoC integrating the power management and the baseband chip,” Andrici reports. “Overall, it is being said that other chips as well are integrated into ‘packages,’ with the motherboard’s components looking somewhat simplified.”

Andrici reports, “It’s also being claimed that the area occupied by the A9 chipset is by 15% smaller than the space occupied by the Apple A8 SoC and that the iPhone 6s will come in 16, 64 and 128GB versions.”

Read more in the full article here.

MacDailyNews Take: Apple Watch employs the Apple S1 SiP with its application processor, memory, storage, support processors and sensors bundled into a single package, so it’s not a stretch to think that iPhone is headed in that direction, too.

SEE ALSO:
Apple Watch more powerful than the first iPad – January 23, 2015

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12 Comments

  1. Unlikely, because SiP only makes sense when it is possible to dissipate heat, and not a lot of it. iPhone’s SoC generates order of magnitude more heat than Apple Watches’, let alone cellular module.

    At best, due to heat issues, Apple might be able to only make partial SiP, which is, strictly speaking, will not be really SiP in that case.

    1. It’s likely that the A9 SiP generates significantly less heat than the A8 SoC, so the iPhone 6S architecture isn’t going to have to dissipate A8-level heat waste.

        1. The A9 is faster, but the transistors are significantly smaller, packed tighter, and are on a smaller die the A8. All of those things contribute to a reduction in heat waste.

    1. System in Package

      Similar to SoC (System on Chip), which Apple currently uses, but essentially brings *everything* together into a single die. The Apple Watch currently uses SiP technology, whereas iPhones and iPads use SoC.

        1. I think you are more correct, power management and processor core have never been integrated on a single die yet that i know of, but in a package yes

          single package does not equal a single die

    2. System in Package. Instead of a motherboard with discrete chips soldered all over it. A SiP takes a large portion of these critical system chips and molds them (encased in a plastic) into a single modular package.

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