“A new report out of China claims that Apple has contracted with Taiwan’s Chipbond Science and Technology to build fingerprint sensors into its next-generation iPhone,” AppleInsider reports.
“The details were reported on Monday by China Times, which claimed that the so-called ‘iPhone 5S’ will include both a fingerprint sensor and a near-field communications chip for mobile payments,” AppleInsider reports. “The two items are expected to work in concert with one another, allowing users to easily authorize a transaction with their fingerprint.”
AppleInsider reports, “The details reported on Monday align with what was previously claimed by analyst Ming-chi Kuo of KGI Securities, who has a reliable track record in predicting Apple’s future product pipeline. Kuo believes the new iPhone 5S will launch sometime in June or July… ”
Read more in the full article here.
[Thanks to MacDailyNews Readers “Brawndo Drinker” and “Lynn Weiler” for the heads up.]
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