“Apple has reportedly lined up components to manufacture its next-generation iPhone as it preps a Q3 launch, but the device appears to be tricky to make,” Larry Dignan reports for ZDNet. “That fact is likely to give a big headache to Hon Hai Precision, which manufactures the iPhone via its Foxconn unit.”
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Dignan reports, “The Wall Street Journal reports that the latest iPhone will be thinner and lighter than the iPhone 4… The next-gen iPhone is reportedly “complicated and difficult to assemble.” Last month, Hon Hai Chairman Terry Gou acknowledged that the iPhone was difficult to make.”
Read more in the full article here.
[Thanks to MacDailyNews Reader “Fred Mertz” for the heads up.]