“Accordingly, TSMC has applied its newest 28-nanometer process and 3D stacking technologies to produce the next-generation processor A6, which is based on the ARM architecture and will undergo TSMC’s cutting-edge silicon interposer and bump on trace (BOT) methodologies,” Chuang reports. “Noteworthily, Taiwan’s leading semiconductor testing and packaging company, Advanced Semiconductor Engineering Inc, is expected to also benefit from the A6 processor production, noted the sources, saying that the company, which has partnered TSMC to develop the 3D chip-packaging technology, is very likely to snap up the order for processor packaging in the future.”
Read more in the full article here.
MacDailyNews Take: Note to Samsung: Those who play with fire, risk getting burned.
Apple’s A6 processor for iOS devices: 28-nm, 3D IC and likely made by TSMC; could show up in future Macs – July 15, 2011
With ‘A6′ chip, Apple likely to move SoC production away from Samsung in 2012 – June 27, 2011
RUMOR: Apple inks deal with TSMC foundry for A5 processor; possible setback for Samsung – March 9, 2011