“Apple has arranged for a representative to meet with Taiwanese touchscreen-related manufacturer GIS next week to discuss development of an iPhone with an under-display fingerprint scanner for release as early as next year, according to a pair of reports from the Economic Daily News,” Joe Rossignol reports for MacRumors:
The reports claim that Apple plans to use Qualcomm’s ultrasonic fingerprint sensor technology in at least one iPhone model set to be released in 2020, although the timeframe could be pushed back to 2021. GIS would cooperate with Qualcomm to supply necessary components.
This lines up with recent reports from analyst Ming-Chi Kuo, Barclays analysts, Bloomberg, and others who expect Apple to release an iPhone with both Face ID and under-display fingerprint authentication in 2020 or 2021.
MacDailyNews Note: Qualcomm today unveiled new 3D Sonic Fingerprint Technology called 3D Sonic Max, the latest version of the company’s ultrasonic fingerprint sensor. 3D Sonic Max offers a recognition area that is 17x larger than the previous generation, allowing for increased security via simultaneous two-finger authentication, increased speed and ease of use.