“We’ve already seen a number of part leaks from the upcoming ‘iPhone 6s,’ and a source has now provided MacRumors with several photos and videos showing how those parts can be combined to build a partially functioning iPhone,” Eric Slivka reports for MacRumors.
“In addition to the iPhone 6s built from parts, we’ve also received photos of an iPhone 6s logic board showing some details of the device’s main components,” Slivka reports. “Previous leaks have shown the logic board to contain Qualcomm’s MDM9635M LTE baseband modem to support faster LTE with increased power efficiency, and our own photos have now confirmed the iPhone 6s will also include Qualcomm’s WTR3925 radio frequency transceiver chip to pair with the new modem for enhanced cellular network performance.”
“Perhaps the most anticipated part from the iPhone 6s from a technical perspective is the A9 chip that serves as the heart of the device. Unfortunately, the logic board we received pictures of appears to be a pre-production unit that is missing some details including the A9 stamp itself and markings that would reveal how much RAM is included in the package,” Slivka reports. “We can see, however, that that the A9 package is roughly 10 percent larger in area than the A8 package found in the iPhone 6.”
More details and photos in the full article here.
MacDailyNews Take: Just a couple weeks more to go!
[Thanks to MacDailyNews Readers “Fred Mertz” and “Dan K.” or the heads up.]
Gees, if you are going to go to all the trouble of getting one of these gadgets, you would think they could get someone who can focus and hold a camera steady.
The A9 package is 10% larger than the A8??? With the die shrinkage, this gets pretty interesting.