“In addition, Chai noted that though TSMC with its 20nm SoC process will most likely secure its first chip orders from Apple, the foundry’s 16nm FinFET process will play a key role in Apple’s ‘breakthrough’ product,” Shen reports. “TSMC’s 20nm SoC process should be able to enter mass production between fourth-quarter 2013 and first-quarter 2014, followed by a newer 16nm FinFET node in less than one year, Chai said.”
Read more in the full article here.
[Attribution: Patently Apple. Thanks to MacDailyNews Reader “Dan K.” for the heads up.]