Tag: wafer-level packaging

TSMC set to oust Samsung for future Apple chip fabrication

Monday, September 28, 2015 3:55 pmMonday, September 28, 201511 Comments

Despite a late start in TSMC’s 16 nm FinFET process, TSMC appears to have captured…

TSMC to be Apple’s exclusive A10 chip fab

Monday, September 14, 2015 1:55 pmMonday, September 14, 20158 Comments

Taiwan-based TSMC will be the exclusive manufacturer behind Apple’s next mobile chipset, the Apple A10 SoC…

TSMC shifts to 8-inch process to produce next-gen iPhone’s Touch ID fingerprint sensors

Tuesday, February 11, 2014 9:26 amTuesday, February 11, 20144 Comments

Acknowledging risks associated with 12-inch WLP technologies, Apple has…