Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker and a major Apple supplier, has completed the purchase of a second parcel of land in Arizona to fuel further expansion of its U.S. operations, as the company responds to explosive demand for AI-related chips and hints at additional capacity during its latest earnings call.
This move builds on the landmark U.S.-Taiwan trade agreement announced on January 15, 2026, under which Taiwanese firms—including TSMC—will drive $250 billion in investments into American semiconductor, energy, and AI production, crediting initiatives advanced by the Trump administration that have encouraged massive onshoring of critical chip manufacturing.
With its first fab already in volume production and more facilities ramping up, TSMC continues to deepen its strategic presence in the U.S. to serve key clients like Apple and Nvidia.
Reuters:
January 2026: TSMC says it has completed the purchase of a second parcel of land in the U.S. state of Arizona to support its expansion plan and give it more flexibility to respond to strong AI-related demand. The plan would enable TSMC to scale up an independent gigafab cluster in Arizona.
March 2025: TSMC says it will expand its U.S. investment to a total of $165 billion, including three additional fabs, two advanced packaging facilities and an R&D centre.
Apple, Nvidia, AMD, and Qualcomm are customers of TSMC’s Arizona fabs. In April 2025, Apple CEO Tim Cook said Apple is TSMC Arizona’s first and largest customer. In October 2025, TSMC Arizona began volume production of Nvidia’s Blackwell GPUs using its advanced N4P process.
MacDailyNews Take: TSMC’s American investments are moving right along!
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