Apple’s next-generation A20 chip, leveraging TSMC’s second-gen 2nm process (N2), will be smaller, more power-efficient, and positioned closer to its onboard memory, boosting performance and reducing power consumption for tasks like AI processing and high-end gaming.
According to analyst Jeff Pu in a new report for GF Securities, the iPhone 18 Pro, 18 Pro Max, and the long-rumored iPhone 18 Fold are expected to debut Apple’s A20 chip, built on TSMC’s second-gen 2nm process (N2).
But that’s only part of the story. The more interesting bit is how those chips will be assembled.
For the first time, Apple is set to adopt Wafer-Level Multi-Chip Module (WMCM) packaging for its iPhone processors. WMCM allows different components, like the SoC and DRAM, to be integrated directly at the wafer level, before being diced into individual chips…
For Apple, this is a big leap in chip design, similar to when it adopted 3nm ahead of most of the industry. And for the broader mobile market, it suggests that technologies once reserved for data center GPUs and AI accelerators are making their way into smartphones.
MacDailyNews Take: Already the wannabes can’t keep up with Apple Silicon’s next major leap looming!
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Whatever tech Apple uses, rival companies will quickly be using the same tech. It’s not as though Apple has any exclusive use of that tech. I think I had read that other companies had already signed up for the new wafers, and those companies were AI companies wanting to expand their data centers all over the world. Yes, it’s good Apple is constantly moving forward, but there are plenty of bigger spenders than Apple that are much more serious about company expansion. They all want to fire human employees and replace them with AI chips. I’m so glad I’m retired and don’t have to worry about losing my job to faster chips.
Excited to see how the new 2nm A20 chip will impact performance! Apple’s innovation never ceases to amaze. Can’t wait for the official launch!
Exciting news about the new A20 chip! Can’t wait to see how it performs and the impact it will have on future Apple devices. The packaging breakthrough sounds promising!