“Apple’s typically happy to trade battery size for a thinner frame when it comes to each new iPhone, but that may change later this year with the iPhone 7,” Jacob Kleinman reports for TechnoBuffalo. “ETNews reports that the device could sport a bigger battery and a slimmer design thanks to new fan-out chip technology.”
“Apple’s new A10 chip may pack silicon chips and semiconductor compounds together, allowing for a more compact design,” Kleinman reports. “The result should be a more powerful processor that takes up less space inside the device, providing more room for the iPhone 7 battery.”
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“Apple may be using the so-called ‘fan-out'” chip packaging method for the first time in a handset with the iPhone 7, resulting in a more compact motherboard and antenna area, leaving extra space inside for an eventual larger battery to sprawl, despite the purported thinner chassis,” iPhoneArena reports. “This packaging technology fuses the silicon chips and the semiconductor compounds together, resulting in more powerful yet more compact chippery.”
“All welcome changes, but not the only benefits of the ‘fan-out’ tech,” iPhoneArena reports. “It is actually the ASM (Antenna Switching Module) that will see advantages of merging the silicon chip with GaAs (Gallium Arsenide) semiconductor compound, as is tipped to happen in the iPhone 7. Gallium arsenide is good for receiving high-frequency signals with little interference, improving on the signal penetration, but so far two modules were needed on the circuit board, whereas merging them in one with “fan-out” will now save space, yet have the same level of antenna efficiency.”
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MacDailyNews Take: Better battery and still even thinner? iPhone 7 will be Apple’s most massive hit yet!