“Supply chain news out of Taiwan today states that Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor,” Jack Purcher reports for Patently Apple, “with the remaining 20% will be taken over by Advanced Semiconductor Engineering (ASE).”
“Taiwan Semiconductor Manufacturing Company (TSMC), which is believed to have landed foundry orders for Apple’s next-generation A8 chip,” Purcher reports, “will start ramping up production using 20nm process technology for Apple’s A8 chip in the second quarter of 2014.”
Read more in the full article here.
[Thanks to MacDailyNews Reader “Dan K.” for the heads up.]