“Taiwan Semiconductor Manufacturing Company (TSMC) is expected to tape out Apple’s A7 processor on a 20nm process in March and then move the chip into risk production in May-June, which will pave the way for commercial shipments in the first quarter of 2014, according to industry sources,” Josephine Lien and Steve Shen report for DigiTimes. “TSMC declined to comment on market report.”
Lien and Shen report, “TSMC will utilize 14-fab to manufacture the A7 chips for Apple.”
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