Transparent, flexible ‘3D’ memory chips may be the next big thing in iPhones, iPads

“New memory chips that are transparent, flexible enough to be folded like a sheet of paper, shrug off 1,000-degree Fahrenheit temperatures — twice as hot as the max in a kitchen oven — and survive other hostile conditions could usher in the development of next-generation flash-competitive memory for tomorrow’s keychain drives, cell phones and computers, a scientist reported March 27,” ScienceDaily reports.

“Speaking at the 243rd National Meeting & Exposition of the American Chemical Society, the world’s largest scientific society, he said devices with these chips could retain data despite an accidental trip through the drier — or even a voyage to Mars. And with a unique 3-D internal architecture, the new chips could pack extra gigabytes of data while taking up less space,” ScienceDaily reports. “‘These new chips are really big for the electronics industry because they are now looking for replacements for flash memory,’ said James M. Tour, Ph.D., who led the research team. ‘These new memory chips have numerous advantages over the chips today that are workhorses for data storage in hundreds of millions of flash, or thumb drives, smart phones, computers and other products. Flash has about another six or seven years in which it can be built smaller, but then developers hit fundamental barriers.'”

“Current touch screens are made of indium tin oxide and glass, both of which are brittle and can break easily. However, plastic containing the memory chips could replace those screens with the added bonuses of being flexible while also storing large amounts of memory, freeing up space elsewhere in a phone for other components that could provide other services and functions. Alternatively, storing memory in small chips in the screen instead of within large components inside the body of a phone could allow manufacturers to make these devices much thinner,” ScienceDaily reports. “The easy-to-fabricate memory chips are patented, and Tour is talking to manufacturers about embedding the chips into products.”

Read more in the full article here.

[Thanks to MacDailyNews Reader “Edward Weber” for the heads up.]


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