“TI has teased its first practical OMAP5 reference hardware,” Electronista reports. “The dual-core, dual-graphics ARM-Cortex A15 device shown to Engadget by VP Remi El-Ouazzane was capable of playing 1080p content at 64 frames per second… ‘This is the greatest platform on Earth right now… way ahead of Apple,’ he said during a live interview.”
“The hardware wasn’t yet ready for smartphone-class hardware. Its reference device is an inch thick,” Electronista reports. “It could be on the market [intablets, ultrabooks, and other relatively large devices] in late 2012 or early 2013.”
Electronista reports, “While claiming a technical edge over Apple, the difference is likely to be short-lived. Apple is widely though to be readying the A6 for its 2012 iOS devices and could either take TI’s route or go to quad-core. The A6 could use a 28-nanometer manufacturing process that would make it viable for tablets and smartphones.”
Full article with photo here.
MacDailyNews Take: It’s highly likely that Apple’s chip group is thanking El-Ouazzane for starting their day out with a hearty laugh.
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GPU candidates for Apple’s future iPad, iPhone, TVs are 20 times more powerful – January 10, 2012
2012: Apple’s quad-core A6-powered iPhone 5 incinerates Android – December 7, 2011
TSMC lands contract to produce Apple’s next-gen ‘A6′ and ‘A7′ processors, say sources – September 16, 2011
TSMC reportedly gearing up for mass production of Apple ‘A6′ processors – September 8, 2011
It’s one thing to have plans to launch something that in 2013 will be way ahead of where Apple is now, but it’s a trickier challenge to bring out something in 2013 that will be way ahead of what Apple is actually doing in 2013.
I think you mean:
“… will be way ahead of what Apple is phasing out now, …”
+1
Yes, their currently unavailable, unusable, experimental device is “way ahead” of Apple’s current retail offerings. Who would have guessed?
It will be DOA, or, more likely, DBA (Dead BEFORE Arrival)!
Love MDNs take. I can just see it now.
Real artists ship.
This made me chortle. “We have figured out how to shove a chicken into a duck into a turkey, slap on a steam engine, add some freshly designed silicon from left over breast implants and put it all into a package that can cluck, quack, gobble and pole dance all at the same time! It is the most sophisticated platform out there and will be known as the Turducken, stripper, computational TI 309 Padometer, ready sometime in 2013. Watch out Apple, your days are numbered!”
Awesome. Thanks.
Is that a ti phone in your pants or are you just happy yo see me?
An inch thick device? Must be for the giant f***ing battery it will need.
Indeed. Anything that is an inch thick cannot be accurately described as being ahead of Apple.
We’re going back to the brick phone designs?
Isn’t it always the case. This happens with the phones and tablets constantly. Companies announce they “will have” a product that they claim is better than Apple’s (except when the whole truth is known; they are really comparing what Apple shipped a year ago, and it really is a stretch to call it better as it has a number of serious flaws, and it really isn’t shipping for 6 months, etc, etc, etc.)
Miniaturization is key for electronics- its what made Sony (in its day) King.
A Mac Pro with the multiple i6 cores and the latest GPU boards is much faster than the OMAP5. However, it is several cubic feet in size, so not quite able to be squeezed into a smartphone yet.
“The greatest platform on earth” – for Bunkum & Bailey’s Flea Circus.
When the iPad 3 turns out to be equipped with a 210 GFLOP GPU powering a 9.7″ Retina display, I’d love to see what Texas Instruments has to say about it.
Hopefully MDN will iCal this one.
There’s no reason to assume what TI shows today as an early prototype trumps what Apple has in its development labs that they’re simply not ready to show you. That would spoil the surprise that is surely coming.
Incredibly silly of TI, since everyone is basing their next-gen chips off ARM Cortex A15. Apple, Nvidia, Qualcomm, and TI.
The quantum computer design I have in my head is way more advanced than anything Apple offers today.
Do not buy any Apple products. Wait for my design and when it’s ready in 5 years, God willing, you will love me.
TI – skating to where the puck was, not to where it will be.
Dang, it is bigger! Apple better make thicker iPhones to compete with this.
iBrick.
Balmer reminds me of ‘Uncle Fester’ from the Adams family.
If your aunt had balls she’d be your uncle. Until then, still your aunt. Come on TI. Show us when your aunt actually has the balls.
Something about that 1″ thick prototype tells me there’s a big unspoken caveat, but, for consumer’s sake, I hope TI can make good on their promise. Apple would easily keep up … all the better for us.
Am I the only one that read this article? It’s a “reference” piece of hardware to demo what’s possible based on TI chip platforms. Nothing said anything about an end user product that is an inch thick that TI is going to ship. Nor did it say this is exactly what is planning to be made for 2013. Clearly then, Apple will have an “A-whatever” chip and new devices. All TI did is say they have a chipset and design that right now outpaces spec and performance over Apple’s current chips. It’s a platform, not a product. I’m not sure how any of you don’t get that. Dozens of TI components are already inside Apple products as is. TI is probably looking to sell this to companies to compete along with Apple and Samsung produced chips as well as the mobile platform NVidia offers…not fully produced devices like tablets.
They’re demoing a product that isn’t even scheduled to be released for over a year, which likely means it’s two or more years away, if it ever does come to fruition, and they’re claiming to be ahead of Apple?
Apple’s product is available now. It isn’t vapor.
And just because they’ve actually come to market with a product, does not mean that they have discontinued innovation!
I’m sure that Apple has prototype products that are way beyond what they’re offering today too.
The difference is, Apple has a product for you now, and another one for then.
Apple to TI: “When you can put this thing in a SHIPPING product, one that, BTW, doesn’t drain the battery in 63 seconds, then come talk to us.”
Nothing is “way ahead” of anything until it ships.