“Compare the iPhone [disassembly] imagery to that of the Compaq iPaq 3835, which was the subject of my Nov. 23, 2006 Prying Eyes piece,” Brian Dipert reports for EDN (formerly Electrical Design News).
“Now consider that the iPhone integrates Wi-Fi, Bluetooth, and GSM cellular data and voice, along with a position sensor, none of which the iPaq provides, along with a much more powerful CPU and substantially more nonvolatile and volatile memory. Finally, realize that the iPhone’s form factor is almost 3× smaller in total volume than that of the iPaq 3835 (in fairness, I should point out that the iPaq 3835’s screen is 0.25-in. wider than that of the iPhone, although the two LCD’s lengths are identical),” Dipert reports.
“After digesting this data, you’ll likely walk away quite impressed, as I was, with the accomplishments of Apple’s electrical and mechanical engineering teams, as well as with the integration accomplishments of Apple’s various semiconductor suppliers,” Dipert reports.
Full article here.
[Thanks to MacDailyNews Reader “KingMel” for the heads up.]
