“Chipmakers are expected to showcase their new-generation chip solutions for AI and 5G applications at the upcoming Mobile World Congress (MWC) trade fair, with Taiwan Semiconductor Manufacturing Company (TSMC) being their major foundry partner thanks to the competitiveness of its EUV-based process technology, according to industry source,” Monica Chen and Jessie Shen reports for DigiTimes.

“In addition, TSMC has obtained 7nm chip orders for 5G related applications including HPC and IoT from AMD, Nvidia, Xilinx, NXP, OmniVision and TI, the sources added,” Chen and Shen reports. “TSMC is expected to secure the first 5nm chip orders from Apple for the 2020 iPhones, the sources continued.”

Chen and Shen reports, “TSMC expressed previously optimism about its performance in 2020 and 2021, when 5G and other emerging technologies mature.”

Read more in the full article here.

MacDailyNews Take: Hello, ARM-powered Macs!

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