“Taiwan Semiconductor Manufacturing Company (TSMC) reportedly will begin producing fingerprint sensors for Apple’s next-generation iPhone at its 12-inch fab using a 65nm process in the second quarter of 2014, according to industry sources,” Josephine Lien and Steve Shen report for DigiTimes.

“TSMC has been fabricating the fingerprint sensors for iPhone 5s at its 8-inch fabs, while outsourcing the backend services to Xintec, China Wafer Level CSP and Advanced Semiconductor Engineering (ASE),” Lien and Shen report. “Meanwhile, TSMC will also begin to produce application processors for Apple soon using a 20nm process, said the sources, noting that the production of APs will be ramped up significantly starting the third quarter.”

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