“A forum thread posted to Chinese site WeiPhone.com earlier this month claims that Apple is planning to introduce its next iMac at a press conference either this month or next month, with the new iMac offering a redesigned body with a thinner profile,” Eric Slivka reports for MacRumors. “The report includes a photo of what is said to be the logic board and other internal components of the new iMac.”

“The redesigned iMac is said to be considerably thinner than the current form factor, with the machine’s thickness almost impossible to gauge when viewed from the side,” Slivka reports. “The curved rear shell is also said to appear more like a water droplet than the squared-off design seen in the current model.”

Slivka reports, “The report also claims that the new iMac’s screen is glued to the front glass of the machine, in line with previous rumors stating that Apple is moving to fully laminate the two components together for improved display quality.”

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