“Chip vendors including Qualcomm, Broadcom, STMicroelectronics, NXP, Texas Instruments and OmniVision reportedly have started stocking their solutions used for Apple’s next-generation iPhone slated to hit the market in the second half of 2012, according to industry sources,” Cage Chao and Steve Shen report for DigiTimes.

“Qualcomm and Broadcom are producing 4G and Wi-Fi chips using a 28nm process at Taiwan Semiconductor Manufacturing Company (TSMC), indicated the sources, adding that OmniVision is currently also seeking capacity at TSMC’s 12-inch fab, resulting a tight production capacity for the foundry’s 28nm process,” Chao and Shen report. “Qualcomm alone needs about 10,000 28nm 12-inch wafers, or one-third of 28nm capacity at TSMC, for the production of 4G chips for iPhones, not mention the additional supply of 4G chips to other clients, revealed the sources.”

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